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200mm Semiconductor Fab Capacity Set to Surge 21% to Mitigate Supply-Demand Imbalance, SEMI Reports


MILPITAS, Calif., April 11, 2022 /PRNewswire/ — Semiconductor manufacturers worldwide are on track to boost 200mm fab capacity by 1.2 million wafers, or 21%, from the start of 2020 to the end of 2024 to hit a record high of 6.9 million wafers per month, SEMI announced today in its 200mm Fab Outlook Report. After climbing to $5.3 billion last year, 200mm fab equipment spending is expected to be $4.9 billion in 2022 as 200mm fab utilization remains at high levels and the global semiconductor industry works to overcome the chip shortage.

200mm installed semiconductor capacity and fab count, 2013 to 2024*, * Fab count is net of wafer-size conversions.

“Wafer manufacturers will add 25 new 200mm lines over the five-year period to help meet growing demand for applications such as 5G, automotive and Internet of Things (IoT) devices that rely on devices like analog, power management and display driver integrated circuits (ICs), MOSFETs, microcontroller units (MCUs) and sensors,” said Ajit Manocha, SEMI president and CEO.

The SEMI 200mm Fab Outlook Report, covering the 12 years from 2013 to 2024, also reveals that foundries will account for more than 50% of fab capacity worldwide this year, followed by analog at 19% and discrete/power at 12%. Regionally, China will lead the world in 200mm capacity with 21% share in 2022, followed by Japan with 16% and Taiwan and Europe/Mideast at 15% each.

Equipment investments are projected to remain above $3 billion in 2023, with the foundry sector accounting for 54%, followed by discrete/power at 20% and analog at 19%.

The SEMI 200mm Fab Outlook Report lists more than 330 fabs and lines and includes 64 changes across 47 fabs since its most recent update in September 2021.

About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contacts

Michael Hall/SEMI

Phone: 1.408.943.7988

Email: [email protected]

Christian G. Dieseldorff/SEMI

Phone: 1.408.943.7940

Email: [email protected]

SEMI® connects 2,000+ member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. SEMI builds connections that help its members prosper, create new markets, and address common industry challenges together. Visit http://www.semi.org

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